Bolix - adhesive for expanded polystyrene boards Bolix U
Bolix - adhesive for expanded polystyrene boards Bolix U

Bolix - adhesive for expanded polystyrene boards Bolix U

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It is used for gluing foamed polystyrene boards to typical mineral substrates and making a layer reinforced with expanded fiberglass mesh on foamed polystyrene. It is used when insulating external walls of buildings in the technology of a seamless thermal insulation system. It is also used for leveling (unevenness up to 5 mm) and smoothing mineral substrates before applying paint and thin-layer plasters.
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całkowita cena cennikowa brutto
zł63.96
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całkowita cena cennikowa netto
zł48.00
za 1 opakowanie
całkowita cena cennikowa brutto
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za 1 opakowanie

Products description

It is used for gluing foamed polystyrene boards to typical mineral substrates and making a layer reinforced with foamed fiberglass mesh. It is used when insulating external walls of buildings in the technology of seamless thermal insulation system. It is also used for leveling (unevenness up to 5 mm) and smoothing mineral substrates before applying paint and thin-layer plaster.

Technical data:

  • Mixing proportions: 4.5-5.0 l of water per 25 kg of glue
  • Open work time: approx. 1.5 hours
  • Flow: <0.12 mm
  • Adhesion:
    • adhesion to concrete:> 0.6 MPa
    • for foamed polystyrene:> 0.1 MPa (tear in the foamed polystyrene layer)
  • Consistency: dry powder
  • all technical specifications are given for a relative humidity of 60% and an air temperature of +20 ° C
  • Consumption of adhesive mortar when insulating the building:
  • when bonding foamed polystyrene boards on a properly prepared base, it is approx. 4.0 kg / m2
  • when making the reinforced layer it is about 4.0 kg / m2
  • Composition: BOLIX U glue is a dry mix of hydraulic binders, polymer, base of fine-grained mineral fillers and modifying additives.

Specification

application temperature range
5 - 25 °C
color
grey
substrate temperature
5 - 25 °C
bulk density
1,6 kg/dm³
MPN
11450

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