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Bolix - lepidlo Bolix Z na polystyren

Name: Bolix - lepidlo Bolix Z na polystyren
Brand: Bolix
Price: 46.74 PLN
Availability: InStock

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It is used for gluing foamed polystyrene boards to typical mineral substrates. It is used when insulating external walls of buildings in the technology of a seamless thermal insulation system.

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46,74 zł 46,74 zł

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Najniższa cena z ostatnich 30 dni: 46,74 zł brutto. (38,00 zł)

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całkowita cena cennikowa brutto

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całkowita cena cennikowa netto

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całkowita cena cennikowa brutto

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Products description

It is used for gluing foamed polystyrene boards to typical mineral substrates. It is used when insulating external walls of buildings in the technology of seamless thermal insulation system. WARNING! To make the reinforced layer on foamed polystyrene boards, use BOLIX U universal adhesive.

Technical data

Mixing proportions: 4.8-5.3 l of water per 25 kg of glue
Flow: <0.12 mm
Adhesion:
- adhesion to concrete:> 0.3 MPa
- adhesion to foamed polystyrene:> 0.1 MPa (tear in the foamed polystyrene layer)
Consistency: dry powder
all technical specifications are given for a relative humidity of 60% and an air temperature of +20 ° C
The consumption of adhesive mortar for gluing foamed polystyrene boards on a properly prepared base while insulating the building is approx. 4.0 kg / m2. In order to accurately determine the product consumption on a given substrate, it is recommended to carry out appropriate tests.
Composition: BOLIX Z adhesive is a dry mixture of hydraulic binders, polymer, base of fine-grained mineral fillers and modifying additives.